skip to main content
OSTI.GOV title logo U.S. Department of Energy
Office of Scientific and Technical Information

Title: DEVELOPMENT OF PROCEDURES AND TECHNIQUES FOR PREPARING BONDED DOUBLE LAYER TANTALUM-COPPER COMPOSITE PLATES. Period covered : May 1957 to August 1958

Technical Report ·
OSTI ID:4259153

The purpose of this project was to develop a process for bonding tantalum sheet to OFHC coppe. This was successfully accomplished both by casting molten copper directly into an annealed tantalum ccone under controlled vacuum- inert gas atmospheres, and by using integrity, vacuum bonded joints between OFHC copper and annealed tantalum. Metallurgical and microhardness e effected, with ductile interfaces, in joining OFHC copper to annealed tantalum by vaccuum-inert gas techniques. Physical tests on brazed copper-tantalum er deg flat bends and in a cold forming of flat composite plate into nose-cone shapes. Elevated temperature tests on copper-tantalum clad nose-cones, both uncoated and metal or ceramic coated on the exposed tantalum surfaces, exhibited the ability of selected brazing alloys to maintain intimate contact between the copper and tantalum at temperatures up to the melting point of copper. The high thermal conductivity of the copper layer enabled it to absorb sufficient heat from the tantalum surface to allow the tantalum cone shell to contain the molten copper as long as two minutes at temperatures above 2000 deg C (measured optically on the exposed tantalum). (auth)

Research Organization:
Stanford Research Inst., Menlo Park, Calif.
DOE Contract Number:
AF33(616)-5215
NSA Number:
NSA-13-007752
OSTI ID:
4259153
Report Number(s):
WADC-TR-58-396; AD-203901
Resource Relation:
Other Information: Project title: ATLAS MATERIALS. Task title: GRAPHITE-BASED MATERIALS FOR HIGH TEMPERATURE APPLICATIONS. Orig. Receipt Date: 31-DEC-59
Country of Publication:
United States
Language:
English