Methods of designing thermoelectric cooling devices for specific applications
Conference
·
OSTI ID:423097
- Melcor Corp., Trenton, NJ (United States)
This paper serves as a step by step procedure for designing or selecting the thermoelectric cooler (TEC) best suited for an application. It begins with procedures for determining values of T{sub H}, T{sub C}, and Q{sub C}. These values are then used in graphs and equations to determine the TEC element geometry and number of thermocouples required for the specific design. The application of this procedure is illustrated through a series of steps involving TECs for different needs and limitations such as steady state heat pumping, transient response, maximum efficiency, heat flux density, specific power constraints, footprint, bipolar operation and heat exchanger thermal resistance.
- OSTI ID:
- 423097
- Report Number(s):
- CONF-960815--; ISBN 0-7918-1511-0
- Country of Publication:
- United States
- Language:
- English
Similar Records
Advanced heat exchange technology for thermoelectric cooling devices
Thermoelectric cooled, purge-and-trap device for enhancing the utility of fiber optic VOC sensors
Electronic cooling using thermoelectric devices
Conference
·
Mon Dec 30 23:00:00 EST 1996
·
OSTI ID:423096
Thermoelectric cooled, purge-and-trap device for enhancing the utility of fiber optic VOC sensors
Conference
·
Sun Aug 01 00:00:00 EDT 1993
·
OSTI ID:10190179
Electronic cooling using thermoelectric devices
Journal Article
·
Mon May 18 00:00:00 EDT 2015
· Applied Physics Letters
·
OSTI ID:22402477