NICKEL PLATING PROCESS
Patent
·
OSTI ID:4226396
A simplified process is presented for plating nickel by the vapor decomposition of nickel carbonyl. In a preferred form of the invention a solid surface is nickel plated by subjecting the surface to contact with a mixture containing by volume approximately 20% nickel carbonyl vapor, 2% hydrogen sulfide and .l% water vapor or 1% oxygen and the remainder carbon dioxide at room temperature until the desired thickness of nickel is obtained. The advantage of this composition over others is that the normally explosive nickel carbonyl is greatly stabilized.
- Research Organization:
- Originating Research Org. not identified
- NSA Number:
- NSA-13-022512
- Assignee:
- U.S. Atomic Energy Commission
- Patent Number(s):
- US 2886468
- OSTI ID:
- 4226396
- Resource Relation:
- Other Information: Orig. Receipt Date: 31-DEC-59
- Country of Publication:
- United States
- Language:
- English
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