Present and future environmental ``problems`` with SF{sub 6} and other fluorinated gases
Conference
·
OSTI ID:419800
- National Inst. of Standards and Technology, Gaithersburg, MD (United States)
Sulfur hexafluoride (SF{sub 6}) is widely used as an insulating and arc interrupting gas in high-voltage systems and has found application in plasma processing of materials. However, SF{sub 6} is known to decompose in electrical discharges to form toxic and corrosive gaseous compounds such as SOF{sub 4}, SOF{sub 2}, SO{sub 2}F{sub 2}, and HF. Of particular concern are the species S{sub 2}F{sub 10} and S{sub 2}O{sub 2}F{sub 10} that are known to be highly toxic and to be formed in corona, spark, and arc discharges in high-pressure SF{sub 6}. The conditions under which these byproducts are formed, the methods for removal, and the possible hazards that they present are reviewed. Sulfur hexafluoride is also an efficient absorber of infrared radiation and is estimated to have a global warning potential that is 2.5 {times} 10{sup 4} times greater than that of CO{sub 2}. Methods that have been proposed to control the use of SF{sub 6} and reduce the rate of its release into the atmosphere will be examined. The advantages, disadvantages, and likely problems with finding technically feasible and environmentally acceptable replacements for SF{sub 6} will be discussed.
- OSTI ID:
- 419800
- Report Number(s):
- CONF-960634--
- Country of Publication:
- United States
- Language:
- English
Similar Records
Biological effects of spark-decomposed SF/sub 6/
Evaluation of possible biological effects from exposure to gaseous SF{sub 6} breakdown products
By-product formation in spark breakdown of SF/sub 6//O/sub 2/ mixtures
Conference
·
Thu Dec 31 23:00:00 EST 1987
·
OSTI ID:7070975
Evaluation of possible biological effects from exposure to gaseous SF{sub 6} breakdown products
Conference
·
Tue Jun 01 00:00:00 EDT 1993
·
OSTI ID:138692
By-product formation in spark breakdown of SF/sub 6//O/sub 2/ mixtures
Journal Article
·
Wed Jun 01 00:00:00 EDT 1988
· Plasma Chem. Plasma Process.; (United States)
·
OSTI ID:6363322