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Title: Stress relaxation in tension of CA 172 copper--beryllium

Journal Article · · J. Test. Eval., v. 3, no. 1, pp. 62-67
OSTI ID:4173900

Stress relaxation data on commercially available copper-beryllium alloy 172 are presented. Test samples were subjected to strains of up to 2 percent and temperatures from 25 to 181$sup 0$C. The data show that a high degree of relaxation occurs at higher temperatures and relaxation was found to be independent of the initial stress levels. Time-temperature plots of stress relaxation are presented for designing accelerated relaxation tests on the copper- berylluim alloy tested. The material in the tested condition is generally not used in spring applications and thus results of Austen which compare stress relaxation characteristics of copper-beryllium alloy 172 in the aged and unaged conditions are also presented. (auth)

Research Organization:
Bell Telephone Labs., Inc., Columbus, OH
NSA Number:
NSA-33-006007
OSTI ID:
4173900
Journal Information:
J. Test. Eval., v. 3, no. 1, pp. 62-67, Other Information: Orig. Receipt Date: 30-JUN-76
Country of Publication:
United States
Language:
English