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Title: Development work on a new package design for the next generation microelectronics. Final report

Abstract

AlliedSignal and Micro-Mode Products joined under a DOE CRADA to develop a new package for next-generation electronics devices. Requirements included low cost of manufacture, ability to satisfy thermal expansion requirements, ability to satisfy thermal dissipation requirements, acceptable digital and microwave performance, and hermeticity. Four processes were tested; vacuum deposition of paralene, epoxy powder coating, transfer molding, and manual encapsulation. Transfer molding and manual potting improved the hermeticity but produced microcracking and reduced heat transfer ability following encapsulation. Additional study on manufacturing and encapsulating of the package is needed.

Authors:
 [1];  [2]
  1. AlliedSignal, Inc., Kansas City, MO (United States). Federal Mfg. and Technologies
  2. Micro-Mode Products, Inc., El Cajon, CA (United States)
Publication Date:
Research Org.:
Allied Signal, Inc., Kansas City, MO (United States). Federal Mfg. and Technologies
Sponsoring Org.:
USDOE, Washington, DC (United States)
OSTI Identifier:
414576
Report Number(s):
KCP-613-5853
ON: DE97050575
DOE Contract Number:  
AC04-76DP00613
Resource Type:
Technical Report
Resource Relation:
Other Information: PBD: Nov 1996
Country of Publication:
United States
Language:
English
Subject:
42 ENGINEERING NOT INCLUDED IN OTHER CATEGORIES; MICROELECTRONICS; PACKAGING; ENCAPSULATION; PROGRESS REPORT

Citation Formats

Adams, B.E., and DeMarco, V.. Development work on a new package design for the next generation microelectronics. Final report. United States: N. p., 1996. Web. doi:10.2172/414576.
Adams, B.E., & DeMarco, V.. Development work on a new package design for the next generation microelectronics. Final report. United States. doi:10.2172/414576.
Adams, B.E., and DeMarco, V.. Fri . "Development work on a new package design for the next generation microelectronics. Final report". United States. doi:10.2172/414576. https://www.osti.gov/servlets/purl/414576.
@article{osti_414576,
title = {Development work on a new package design for the next generation microelectronics. Final report},
author = {Adams, B.E. and DeMarco, V.},
abstractNote = {AlliedSignal and Micro-Mode Products joined under a DOE CRADA to develop a new package for next-generation electronics devices. Requirements included low cost of manufacture, ability to satisfy thermal expansion requirements, ability to satisfy thermal dissipation requirements, acceptable digital and microwave performance, and hermeticity. Four processes were tested; vacuum deposition of paralene, epoxy powder coating, transfer molding, and manual encapsulation. Transfer molding and manual potting improved the hermeticity but produced microcracking and reduced heat transfer ability following encapsulation. Additional study on manufacturing and encapsulating of the package is needed.},
doi = {10.2172/414576},
journal = {},
number = ,
volume = ,
place = {United States},
year = {Fri Nov 01 00:00:00 EST 1996},
month = {Fri Nov 01 00:00:00 EST 1996}
}

Technical Report:

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