Development work on a new package design for the next generation microelectronics. Final report
- AlliedSignal, Inc., Kansas City, MO (United States). Federal Mfg. and Technologies
- Micro-Mode Products, Inc., El Cajon, CA (United States)
AlliedSignal and Micro-Mode Products joined under a DOE CRADA to develop a new package for next-generation electronics devices. Requirements included low cost of manufacture, ability to satisfy thermal expansion requirements, ability to satisfy thermal dissipation requirements, acceptable digital and microwave performance, and hermeticity. Four processes were tested; vacuum deposition of paralene, epoxy powder coating, transfer molding, and manual encapsulation. Transfer molding and manual potting improved the hermeticity but produced microcracking and reduced heat transfer ability following encapsulation. Additional study on manufacturing and encapsulating of the package is needed.
- Research Organization:
- Allied Signal, Inc., Kansas City, MO (United States). Federal Mfg. and Technologies
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-76DP00613
- OSTI ID:
- 414576
- Report Number(s):
- KCP-613-5853; ON: DE97050575
- Resource Relation:
- Other Information: PBD: Nov 1996
- Country of Publication:
- United States
- Language:
- English
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