BONDING ALUMINUM METALS
Patent
·
OSTI ID:4002274
A process is given for bonding aluminum to aluminum. Silicon powder is applied to at least one of the two surfaces of the two elements to be bonded, the two elements are assembled and rubbed against each other at room temperature whereby any oxide film is ruptured by the silicon crystals in the interface; thereafter heat and pressure are applied whereby an aluminum-silicon alloy is formed, squeezed out from the interface together with any oxide film, and the elements are bonded.
- Research Organization:
- Originating Research Org. not identified
- NSA Number:
- NSA-15-019821
- Assignee:
- U.S. Atomic Energy Commission
- Patent Number(s):
- US 2987816
- OSTI ID:
- 4002274
- Resource Relation:
- Other Information: Orig. Receipt Date: 31-DEC-61
- Country of Publication:
- United States
- Language:
- English
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