Low temperature oxidation of copper: The formation of CuO

Journal Article · Fri Mar 31 23:00:00 EST 1995 · Materials Research Bulletin

DOI:https://doi.org/10.1016/0025-5408(95)00025-9· OSTI ID:39808

Lenglet, M; Kartouni, K; Machefert, J ^[1]; Claude, J M; Steinmetz, P ^[2]; Beauprez, E; Heinrich, J; Celati, N ^[3]

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1. Univ. de Rouen, Mont Saint Aignan (France). Lab. d`Analyse de Spectroscopie et de Traitement de Surface des Materiaux
2. Univ. de Nancy I, Vandoeuvre (France). Lab. de Chimie Minerale
3. DGA, Arcueil (France)

The study of the early stages of low temperature copper oxidation reveals unambiguously a fast process of Cu to Cu{sub 3}O{sub 2} and a slow process for the formation of CuO and demonstrates the mechanism of nucleation of CuO as a result of the aggregation of vacancies internally in cuprous oxides. Previous studies have shown that low temperature oxidation (T < 573 K) of copper films or bulk copper leads to the formation of a Cu{sub 3}O{sub 2} phase before that of CuO, which is the only thermodynamically stable phase. Stoichiometric Cu{sub 2}O cannot be obtained in these experimental conditions during oxidation of bulk copper.

• OSTI ID: 39808
• Journal Information: Materials Research Bulletin, Journal Name: Materials Research Bulletin Journal Issue: 4 Vol. 30; ISSN MRBUAC; ISSN 0025-5408
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
COPPER
COPPER OXIDES
NUCLEATION
OXIDATION
TEMPERATURE RANGE 0400-1000 K
X-RAY DIFFRACTION