Thermal singularities in film rupture

Journal Article · Sat Nov 30 23:00:00 EST 1996 · Physics of Fluids (1994)

DOI:https://doi.org/10.1063/1.869127· OSTI ID:392671

Oron, A ^[1]; Bankoff, S G; Davis, S H ^[2]

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1. Department of Mechanical Engineering, Technion--Israel Institute of Technology, Haifa 32000 (Israel)
2. Robert R. McCormick School of Engineering and Applied Science, Northwestern University, Evanston, Illinois 60208 (United States)

Long-wave approximation for the spatiotemporal evolution of thermal and evaporative instabilities of a thin liquid film lying on a {open_quote}{open_quote}thick{close_quote}{close_quote} solid substrate is considered. It is shown that accounting for a nonzero thermal resistance of the solid eliminates the emergence of temperature, heat and mass flux singularities at the rupture point. {copyright} {ital 1996 American Institute of Physics.}

• DOE Contract Number: FG02-86ER13641
• OSTI ID: 392671
• Journal Information: Physics of Fluids (1994), Journal Name: Physics of Fluids (1994) Journal Issue: 12 Vol. 8; ISSN 1070-6631; ISSN PHFLE6
• Country of Publication: United States
• Language: English

Related Subjects

66 PHYSICS
EVAPORATION
FILM FLOW
HEAT FLUX
LIQUID FLOW
SINGULARITY
SURFACE TENSION
THIN FILMS