Diamond films for electronic packaging
- Crystallume, 3506 Bassett Street, Santa Clara, California 95054 (United States)
Diamond has the potential for greatly enhancing the thermal performance of electronic packaging by virtue of its extreme thermal conductivity. This is usually envisaged in electronic packaging as relatively thick plates to serve as a heat spreader. Diamond may also be used in electronic packaging as thin (dielectric) layers to a copper heat sink. This and other thin film applications require that there be adequate adhesion between diamond and the metal substrate; an issue greatly complicated by the large thermal expansion differences between diamond and metals. Recent efforts to deposit diamond on metals will be discussed with an emphasis on achieving an adherent coating. {copyright} {ital 1996 American Institute of Physics.}
- OSTI ID:
- 385442
- Report Number(s):
- CONF-960109--
- Journal Information:
- AIP Conference Proceedings, Journal Name: AIP Conference Proceedings Journal Issue: 1 Vol. 361; ISSN 0094-243X; ISSN APCPCS
- Country of Publication:
- United States
- Language:
- English
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