Thermal expansion of copper
Journal Article
·
· High Temperature and Materials Science
OSTI ID:376335
- Univ. of North Carolina, Chapel Hill, NC (United States). Dept. of Geology
The product of thermal expansion, bulk modulus, and volume, {alpha}{sub v}K{sub T}V, is the partial temperature derivative of the work done by thermal pressure. For copper this thermodynamic product resembles a specific heat (C{sub v}) curve and approaches a constant at high temperature. A recently developed model utilizes available data for this parameter and recommends new copper thermal expansion values from 0 K to the melting point.
- OSTI ID:
- 376335
- Journal Information:
- High Temperature and Materials Science, Journal Name: High Temperature and Materials Science Journal Issue: 2 Vol. 35; ISSN 1080-1278; ISSN HTMSFP
- Country of Publication:
- United States
- Language:
- English
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