Thermodynamics and phase diagram of new solder materials
- Univ. Wien, Vienna (Austria). Inst. fuer Anorganische Chemie
Unique physical and mechanical properties made the Pb-Sn solders attractive for low temperature joining of electronic parts. But since lead in solder materials has become a great environmental problem and health concern, lead will be slowly replaced by other materials in soft solders. Some of these materials which are currently under investigation are ternary tin alloys. Many different physical properties like wetting behavior, electrical and thermal conductivity and surface tension are measured on these alloys, but on the thermodynamic properties and the phase diagram of the alloys under discussion there is only little information available. The authors investigated the (Ag, Au, Cu)-Sn-Zn systems and determined the thermodynamic properties over the whole composition range by emf-measurements. From these measurements they also got some information on the liquidus. In the Sn-rich corner the phase diagrams are still under investigation.
- OSTI ID:
- 367621
- Report Number(s):
- CONF-960202--; ISBN 0-87339-310-4
- Country of Publication:
- United States
- Language:
- English
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