On the metallurgy of active brazing of silicon nitride
- Helsinki Univ. of Technology, Espoo (Finland). Dept. of Materials Science and Engineering
- Eindhoven Univ. of Technology (Netherlands)
Activation mechanism and interfacial reactions in brazing of Si{sub 3}N{sub 4} with different AgCuTi filler alloys has been investigated thermodynamically and experimentally. During brazing the AgCuTi filler alloy is divided into two liquids L1 and L2, where the (Cu,Ti)-rich liquid L2 gathers at the Si{sub 3}N{sub 4} interface and reacts with it. The concentration of Ti in L2 is high, but due to the strong attractive interaction between Cu and Ti, the activity of Ti in L2 is considerably low. In reaction between Si{sub 3}N{sub 4} and Cu-containing brazes at Ti-Cu-Si-N compound is typically formed at the interface. In absence of Cu, in joints brazed with AgTi based filler alloys, extremely Ti-rich solution reacts with Si{sub 3}N{sub 4} and as reaction products TiN and Ti{sub 5}Si{sub 3}[N] are formed.
- OSTI ID:
- 367619
- Report Number(s):
- CONF-960202--; ISBN 0-87339-310-4
- Country of Publication:
- United States
- Language:
- English
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