Silicon carbide formation at the joint during infrared bonding of silicon carbide
Book
·
OSTI ID:367618
- Univ. of Cincinnati, OH (United States). Dept. of Materials Science and Engineering
Joining of silicon carbide with infrared using a mixture of Si-30wt.%C as the brazing material has been investigated. Joining was performed at a temperature of 1,500 C in a flowing argon atmosphere for processing times ranging from 5 to 60 seconds. The joining filler materials include thin film silicon obtained by thinning down silicon wafers to about 70 {micro}m and graphite powder of a 15 {micro}m average particle size. Joint strengths were determined with a specially designed shear-in-compression jig for testing shear strengths of brittle materials. Cross section examinations of the joined specimens with optical microscopy, scanning electron microscopy and transmission electron microscopy have shown that all joints are essentially void free with excellent wetting between the base SiC and the brazing material. Silicon carbide in the {beta} form has been identified as the reaction product in the joining zone with a transmission electron microscopy (TEM) and selected area diffraction (SAD) analysis. At 1,500 C with a joining time of 60 seconds, the joint has consisted of primarily SiC. With such a high SiC content in the joint, the joint strength is comparable to those by other joining techniques, such as diffusion bonding, as reported in the literature. A kinetic model for the formation of SiC from liquid silicon and carbon is proposed to explain the observed joint microstructural evolution.
- OSTI ID:
- 367618
- Report Number(s):
- CONF-960202--; ISBN 0-87339-310-4
- Country of Publication:
- United States
- Language:
- English
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