Microwedge indentation of the thin film fine line. 2: Experiment

Journal Article · Thu Aug 01 04:00:00 EDT 1996 · Acta Materialia

DOI:https://doi.org/10.1016/1359-6454(95)00430-0· OSTI ID:367325

De Boer, M P; Gerberich, W W ^[1]

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1. Univ. of Minnesota, Minneapolis, MN (United States). Dept. of Chemical Engineering and Materials Science

Experimental results of microwedge indentation are presented in order to evaluate the thin film fine line on a thick substrate as a fracture mechanics test specimen. Crack length is found to be proportional to indentation volume, allowing assessment of adhesion. The amplitude of single-buckles is used to estimate induced residual stress in the fine line and adhesion is independently assessed. The phenomena of double-buckling and spallation during indentation are experimentally verified, and are used to estimate fracture toughness of the thin film columnar grain boundaries. Although values of adhesion are unreasonably high, cracking of the substrate occurred, violating the critical assumption of negligible substrate compliance. The amplitude assessment gives a more reasonable value. A hypothesis for the complete sequence of events is proposed.

• DOE Contract Number: FG02-84ER45141
• OSTI ID: 367325
• Journal Information: Acta Materialia, Journal Name: Acta Materialia Journal Issue: 8 Vol. 44; ISSN XZ504Y; ISSN 1359-6454
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ADHESION
CRACKS
FRACTURE MECHANICS
FRACTURE PROPERTIES
GRAIN BOUNDARIES
INTERFACES
RESIDUAL STRESSES
SCANNING ELECTRON MICROSCOPY
SILICON OXIDES
TUNGSTEN
YOUNG MODULUS