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Module interconnects on flexible substrates

Journal Article · · AIP Conference Proceedings
DOI:https://doi.org/10.1063/1.57949· OSTI ID:355357
; ;  [1]
  1. Global Solar Energy L.L.C., 5575 So. Houghton Rd., Tucson, Arizona, 85747 (United States)

Challenges posed by the fabrication of monolithic interconnects on photovoltaic (PV) modules made on a flexible, insulating substrate of polyimide are detailed. Scribing requirements and constraints using flexible substrates are compared to those existing for rigid, transparent substrates such as glass. Several approaches which can be pursued to produce low-loss module interconnects on flexible substrates are described. {copyright} {ital 1999 American Institute of Physics.}

Sponsoring Organization:
USDOE
OSTI ID:
355357
Report Number(s):
CONF-980935--
Journal Information:
AIP Conference Proceedings, Journal Name: AIP Conference Proceedings Journal Issue: 1 Vol. 462; ISSN 0094-243X; ISSN APCPCS
Country of Publication:
United States
Language:
English