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High energy electron beam curing of epoxy resin systems incorporating cationic photoinitiators

Patent ·
OSTI ID:335458
A mixture of epoxy resins such as a semi-solid triglycidyl ether of tris (hydroxyphenyl) methane and a low viscosity bisphenol A glycidyl ether and a cationic photoinitiator such as a diaryliodonium salt is cured by irradiating with a dosage of electron beams from about 50 to about 150 kGy, forming a cross-linked epoxy resin polymer.
Research Organization:
Lockheed Martin Energy Syst Inc
Sponsoring Organization:
USDOE, Washington, DC (United States)
DOE Contract Number:
AC05-84OR21400
Assignee:
Lockheed Martin Energy Systems, Inc., Oak Ridge, TN (United States)
Patent Number(s):
US 5,877,229/A/
Application Number:
PAN: 8-507,569
OSTI ID:
335458
Country of Publication:
United States
Language:
English

References (12)

Photo- and thermoinitiated curing of epoxy resins by sulfonium salts journal July 1993
The electron beam-induced cationic polymerization of epoxy resins journal January 1992
Cationic polymerization — Iodonium and sulfonium salt photoinitiators book June 2005
Plasticization and antiplasticization effects of sulphonium salt initiator fragments remaining in cycloaliphatic epoxy resins cured by electron beam and ultraviolet irradiation journal January 1992
New high resolution and high sensitivity deep UV, x-ray, and electron beam resists journal April 1990
Radiation curing of an epoxy-acrylate-6,7-epoxy-3,7-dimethyloctyl acrylate journal April 1991
Electron-beam-induced polymerization of epoxides journal April 1991
High-Energy-Radiation-Induced Cationic Polymerization of Vinyl Ethers in the Presence of Onium Salt Initiators book December 1990
Simple negative resist for deep ultraviolet, electron beam, and x-ray lithography journal November 1989
Application of a new analytical technique of electron distribution calculations to the profile simulation of a high sensitivity negative electron-beam resist journal November 1992
New High‐Resolution and High‐Sensitivity Deep UV, X‐Ray, and Electron‐Beam Resists journal April 1991
Electron beam curing of bisphenol A epoxy resins. [ビスフェノールA型エポキシ樹脂の電子線硬化] journal January 1987

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