Simulation of thermomechanical fatigue in solder joints

Conference · Wed Dec 31 04:00:00 EST 1997

OSTI ID:332734

Fang, H E; Porter, V L; Fye, R M; Holm, E A ^[1]

---

1. Sandia National Labs., Albuquerque, NM (United States)

Thermomechanical fatigue (TMF) is a very complex phenomenon in electronic component systems and has been identified as one prominent degradation mechanism for surface mount solder joints in the stockpile. In order to precisely predict the TMF-related effects on the reliability of electronic components in weapons, a multi-level simulation methodology is being developed at Sandia National Laboratories. This methodology links simulation codes of continuum mechanics (JAS3D), microstructural mechanics (GLAD), and microstructural evolution (PARGRAIN) to treat the disparate length scales that exist between the macroscopic response of the component and the microstructural changes occurring in its constituent materials. JAS3D is used to predict strain/temperature distributions in the component due to environmental variable fluctuations. GLAD identifies damage initiation and accumulation in detail based on the spatial information provided by JAS3D. PARGRAIN simulates the changes of material microstructure, such as the heterogeneous coarsening in Sn-Pb solder, when the component`s service environment varies.

• Research Organization: Sandia National Labs., Albuquerque, NM (United States)
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• OSTI ID: 332734
• Report Number(s): SAND--98-1591; CONF-9709141--PROC.; ON: DE99000778
• Country of Publication: United States
• Language: English

Related Subjects

45 MILITARY TECHNOLOGY, WEAPONRY, AND NATIONAL DEFENSE
99 GENERAL AND MISCELLANEOUS
ELECTRONIC EQUIPMENT
FATIGUE
G CODES
J CODES
MATHEMATICAL MODELS
NUCLEAR WEAPONS
P CODES
SOLDERED JOINTS