Region-of-interest microtomography for component inspection

Journal Article · Sun Jan 31 23:00:00 EST 1999 · IEEE Transactions on Nuclear Science

DOI:https://doi.org/10.1109/23.747765· OSTI ID:328408

Kalukin, A R; Roberge, W G ^[1]; Keane, D T ^[2]

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1. Rensselaer Polytechnic Inst., Troy, NY (United States)
2. DND-CAT Synchrotron Research Center, Argonne, IL (United States)

The authors describe a novel technique for the nondestructive evaluation of microelectronic components using X-ray microtomography. Existing microtomography systems have spatial resolution of order 1 {micro}m but require X-ray source brilliance that would become achievable at higher resolutions. The authors describe an imaging method that reduces the number of X-ray photons required from the source without degrading the resolution. The feasibility of the technique is demonstrated through a series of computer simulations. The results are verified with real data from synchrotron experiments.

• OSTI ID: 328408
• Journal Information: IEEE Transactions on Nuclear Science, Journal Name: IEEE Transactions on Nuclear Science Journal Issue: 1 Vol. 46; ISSN 0018-9499; ISSN IETNAE
• Country of Publication: United States
• Language: English

Related Subjects

07 ISOTOPE AND RADIATION SOURCES
42 ENGINEERING
43 PARTICLE ACCELERATORS
MICROELECTRONIC CIRCUITS
NONDESTRUCTIVE TESTING
SYNCHROTRON RADIATION SOURCES
TOMOGRAPHY
USES
X-RAY SOURCES