Grain growth and kinetics for nanocrystalline NiAl

Journal Article · Fri Dec 18 04:00:00 EST 1998 · Scripta Materialia

DOI:https://doi.org/10.1016/S1359-6462(98)00409-6· OSTI ID:328248

Zhou, L Z; Guo, J T ^[1]

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1. Chinese Academy of Sciences, Shenyang (China). Inst. of Metal Research

The ordered intermetallic NiAl has emerged as a suitable candidate materials for high temperature application because of its high melting point, low density, excellent oxidation resistance, high thermal conductivity, high temperature thermodynamic stability and high stiffness. However, lack of room temperature ductility and toughness are its major shortcomings. As an important new class of nonequilibrium materials, nanocrystalline materials have drawn wide attention in recent years. The interest in these materials stems partly from their potential to transform nominally brittle compounds into ductile materials. However, a problem common to all nanocrystalline materials is their lack of thermal stability. Investigations of the grain size stability have been reported in various nanocrystalline materials, including pure metals, oxides, compounds, and composites. However, reports are still lacking on condensed ordered intermetallics, especially on NiAl. In this work, isothermal and isochronal annealing were carried out on a nanocrystalline NiAl compact prepared by mechanical alloying and vacuum heat pressing, with an effort to investigate its thermal stability.

• OSTI ID: 328248
• Journal Information: Scripta Materialia, Journal Name: Scripta Materialia Journal Issue: 2 Vol. 40; ISSN 1359-6462; ISSN SCMAF7
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ALUMINIUM ALLOYS
ANNEALING
GRAIN GROWTH
GRAIN SIZE
INTERMETALLIC COMPOUNDS
KINETICS
NICKEL ALLOYS