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Fabrication of MEMS Devices by Powder-Filling into DXRL-Formed Molds

Conference ·
OSTI ID:3272

We have developed a variety of processes for fabricating components for micro devices based on deep x-ray lithography (DXRL). Although the techniques are applicable to many materials, we have demonstrated them using hard (Nd{sub 2}Fe{sub 14}B) and soft (Ni-Zn ferrite) magnetic materials because of the importance of these materials in magnetic micro-actuators and other devices and because of the difficulty fabricating them by other means. The simplest technique involves pressing a mixture of magnetic powder and a binder into a DXRL-formed mold. In the second technique, powder is pressed into the mold and then sintered to densify. The other two processes involve pressing at high temperature either powder or a dense bulk material into a ceramic mold that was previously made using a DXRL mold. These techniques allow arbitrary 2-dimensional shapes to be made 10 to 1000 micrometers thick with in-plane dimensions as small as 50 micrometers and dimensional tolerances in the micron range. Bonded isotropic Nd{sub 2}Fe{sub 14}B micromagnets made by these processes had an energy product of 7 MGOe.

Research Organization:
Sandia National Laboratories, Albuquerque, NM, and Livermore, CA
Sponsoring Organization:
USDOE
DOE Contract Number:
AC04-94AL85000
OSTI ID:
3272
Report Number(s):
SAND99-0107C; ON: DE00003272
Country of Publication:
United States
Language:
English

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