Maskless lithography

Patent · 09 February 1999

OSTI ID:321291

Sweatt, W C; Stulen, R H

The present invention provides a method for maskless lithography. A plurality of individually addressable and rotatable micromirrors together comprise a two-dimensional array of micromirrors. Each micromirror in the two-dimensional array can be envisioned as an individually addressable element in the picture that comprises the circuit pattern desired. As each micromirror is addressed it rotates so as to reflect light from a light source onto a portion of the photoresist coated wafer thereby forming a pixel within the circuit pattern. By electronically addressing a two-dimensional array of these micromirrors in the proper sequence a circuit pattern that is comprised of these individual pixels can be constructed on a microchip. The reflecting surface of the micromirror is configured in such a way as to overcome coherence and diffraction effects in order to produce circuit elements having straight sides. 12 figs.

• Research Organization: Sandia Corporation
• Sponsoring Organization: USDOE, Washington, DC (United States)
• DOE Contract Number: AC04-94AL85000
• Assignee: Sandia Corp., Livermore, CA (United States)
• Patent Number(s): US 5,870,176/A/
• Application Number: PAN: 8-878,444
• OSTI ID: 321291
• Country of Publication: United States
• Language: English

Related Subjects

42 ENGINEERING
DESIGN
FABRICATION
MASKING
MICROELECTRONIC CIRCUITS
OPTICAL SYSTEMS
SCREEN PRINTING