The effects of residual stress on modulus measurements by indentation
- Washington State Univ., Pullman, WA (United States)
- Hysitron, Inc., Minneapolis, MN (United States). Nanomechanics Research Lab.
- Univ. of Minnesota, Minneapolis, MN (United States)
Continuous indentation has been used to evaluate the mechanical response of chromium and platinum films deposited on silicon and glass substrates. The traditional method of analysis of indentation data to determine modulus and hardness is sensitive to residual stress in the film, thereby suggesting that modulus measurements may be used to gauge residual stresses. Evaporated metal films, which are under residual tension, tend to show a lower modulus (using standard calculation methods) than the bulk materials. However, a sputtered platinum film exhibits an apparently higher modulus than the bulk material. These data suggest that differences between the calculated and expected modulus using indentation tests cannot be used to unequivocally determine the stress state in a thin film.
- Sponsoring Organization:
- Office of Naval Research, Washington, DC (United States); Sandia National Labs., Albuquerque, NM (United States)
- OSTI ID:
- 305506
- Report Number(s):
- CONF-971201--
- Country of Publication:
- United States
- Language:
- English
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