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Title: Recrystallization of high energy As-implanted GaAs studied by transmission electron microscopy

Journal Article · · Applied Physics Letters
DOI:https://doi.org/10.1063/1.115679· OSTI ID:278897
; ; ;  [1]; ;  [2];  [3]
  1. Lawrence Berkeley National Laboratory, University of California, Berkeley, California 94720 (United States)
  2. Department of Electronic Materials Engineering, Research School of Physical Sciences and Engineering, Australian National University, ACT 0200 Canberra (Australia)
  3. Institute of Experimental Physics, Warsaw University, 00-681 Warsaw (Poland)

Ion implantation damage and the regrowth process during thermal annealing of 2 MeV As-ion-implanted GaAs were studied by transmission electron microscopy. With low-temperature annealing, a high denisty of stacking faults was formed during the recrystallization process, but they were rarely observed with high-temperature annealing. At intermediate temperatures, a much lower denisty of stacking faults was generated at the upper interface between the buried amorphous layer and the crystal than that at the lower interface, where a higher concentration of as-implanted arsenic exists. Based on the observed experimental results, an atomic model is proposed to explain the formation of stacking faults induced by As clusters. {copyright} {ital 1996 American Institute of Physics.}

Research Organization:
Lawrence Berkeley National Lab. (LBNL), Berkeley, CA (United States)
DOE Contract Number:
AC03-76SF00098
OSTI ID:
278897
Journal Information:
Applied Physics Letters, Vol. 68, Issue 11; Other Information: PBD: Mar 1996
Country of Publication:
United States
Language:
English