Fracture toughness and fatigue crack growth of oxide dispersion strengthened copper

Technical Report · Sun Mar 31 23:00:00 EST 1996

DOI:https://doi.org/10.2172/270445· OSTI ID:270445

Alexander, D. J.; Gieseke, B. G. ^[1]

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1. Oak Ridge National Laboratory, TN (United States)

The fracture toughness and fatigue crack growth behavior of copper dispersion strengthened with aluminum oxide (0.15 wt % Al) was examined. In the unirradiated condition, the fracture toughness was about 45 kJ/m{sup 2} (73 MPa{radical}m) at room temperature, but decreased significantly to only 3 Kj/m{sup 2} (20 MPa{radical}m), at 250{degrees}C. After irradiation at approximately 250{degrees}C to about 2.5 displacements per atom (dpa), the toughness was very low, about 1 kJ/m{sup 2} (48 MOa{radical}m), and at 250{degrees}C the toughness was very low, about 1kJ/m{sup 2} (12 mPa{radical}m). The fatigue crack growth rate of unirradiated material at room temperature is similiar to other candidate structural alloys such as V-4Cr-4Ti and 316L stainless steel. The fracture properties of this material at higher temperatures and in controlled environments need further investigation, in both irradiated and unirradiated conditions.

• Research Organization: Oak Ridge National Lab., TN (United States)
• OSTI ID: 270445
• Report Number(s): DOE/ER--0313/19; ORNL/M--5023; ON: DE96010874
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
70 PLASMA PHYSICS AND FUSION TECHNOLOGY
COPPER BASE ALLOYS
CRACK PROPAGATION
DIVERTORS
FATIGUE
FIRST WALL
FRACTURE PROPERTIES
OXYGEN ADDITIONS
PHYSICAL RADIATION EFFECTS
PROGRESS REPORT
THERMONUCLEAR REACTOR MATERIALS