Fatigue and reliability in near eutectic solder alloys for spacecraft applications. Ph.D. Thesis
Thesis/Dissertation
·
OSTI ID:264006
A complex interaction of creep and cyclic fatigue causes failures to occur in soldered structures used for interconnection in electronic assemblies. It is essential to understand the material properties, microstructural characteristics and alloy variations, which contribute to the fatigue process, in order to design, test and manufacture a reliable electronic product. Microstructural coarsening contributes to the creep behavior and mechanical properties in near eutectic alloys. Using a simple model and test method developed for this research, the activation energy of the coarsening process was measured to be 0.42 +/- 0.09 eV. The influence of silver alloying and cerium processing on microstructure and fatigue performance were studied using statistical experimental designs. Silver alloyed near eutectic solder (Sn62) will provide an improvement in fatigue life attributed to a more creep resistant microstructure. Although cerium processing did have some impact on microstructure, there was no statistically significant effect on fatigue life under the test conditions. In addition to understanding microstructure and alloying effects, adequate fatigue models are needed to predict the life of a soldered assembly. Strain energy partitioning techniques, coupled to finite element modeling, appear to be the best alternative.
- Research Organization:
- Johns Hopkins Univ., Baltimore, MD (United States)
- OSTI ID:
- 264006
- Report Number(s):
- N--96-23554; NIPS--96-08277
- Country of Publication:
- United States
- Language:
- English
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