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U.S. Department of Energy
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Heat pipes. (Latest citations from the US Patent Bibliographic file with exemplary claims). Published Search

Technical Report ·
OSTI ID:26237

The bibliography contains citations of selected patents concerning the design, manufacture, and applications of heat pipes. The use of heat pipes in heat exchange systems for heat storage, heat transfer, and heat utilization is discussed. Applications include semiconductor cooling, use in engine components, and building cooling and heating. (Contains 250 citations and includes a subject term index and title list.)

Research Organization:
NERAC, Inc., Tolland, CT (United States)
OSTI ID:
26237
Report Number(s):
PB--95-865754/XAB
Country of Publication:
United States
Language:
English