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Uncooled GeSn MWIR Photodetectors Using Fully Relaxed Thin Triple‐Step Buffer

Journal Article · · Advanced Materials Technologies
GeSn photodetectors monolithically grown on Ge virtual substrates demonstrate mid-wave infrared (MWIR) detection at room temperature. The lattice mismatch between GeSn and Ge causes dislocations and compressive strain, creating leakage pathways and unwanted indirect band transitions. Designed thin Ge0.91Sn0.09 triple-step buffer layers of ≈175 nm total thickness reduce dislocations and enable full relaxation, showing 100% lattice relaxation and smooth surface roughness of 0.83 nm with shorter auto-correlation length in surface morphology compared to single-step buffers. Ge1-xSnx photodetectors (x = 0.09, 0.12, and 0.15) on triple-step buffers with n-i-p configurations achieve lattice strain relaxations of 99%, 88%, and 80%, respectively. Ge0.91Sn0.09 and Ge0.88Sn0.12 show gradual variation in auto-correlation amplitude, while Ge0.85Sn0.15 shows an increase due to lattice mismatch. Shockley–Read–Hall recombination current dominates at low reverse bias due to mismatch-induced dislocations, while band-to-band tunneling current dominates at higher reverse bias due to narrowing bandgap under strong electric fields. Here, the photodetectors show extended spectral response with increasing Sn composition of i-GeSn active layer sandwiched by barriers. Ge0.88Sn0.12 and Ge0.85Sn0.15 exhibit extended wavelength cut-offs of 3.12 and 3.27 µm at room temperature, demonstrating significant potential for silicon-based MWIR applications.
Research Organization:
University of Delaware, Newark, DE (United States)
Sponsoring Organization:
Air Force Office of Scientific Research; National Science Foundation (NSF); USDOE Office of Science (SC), Basic Energy Sciences (BES)
Grant/Contract Number:
SC0023412; SC0025379
OSTI ID:
2583956
Journal Information:
Advanced Materials Technologies, Journal Name: Advanced Materials Technologies Journal Issue: 17 Vol. 10; ISSN 2365-709X
Publisher:
WileyCopyright Statement
Country of Publication:
United States
Language:
English

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