Characterization of Temporal Changes of Interfacial Air Voids During Adhesive Curing and Bonding for Adhesively-Bonded Structures

Conference · Tue Dec 31 04:00:00 EST 2024

DOI:https://doi.org/10.1115/IMECE2024-139915· OSTI ID:2565929

Qiao, Yao ^[1]; Ko, Seunghyun ^[1]; Shin, Yongsoon ^[1]; Ramos, Jose L. ^[1]; Olson, Justin L. ^[1]; Simmons, Kevin L. ^[1]

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1. BATTELLE (PACIFIC NW LAB)

This paper studied the evolution of air voids at the substrate-adhesive interface during the curing and bonding process of an epoxy-based adhesive between two glass substrates due to the sequence of adhesive placement, external pressure, and plasma treatment on substrates for bonding. The experimental results showed that a higher quantity of interfacial voids were generated during adhesive curing when the substrate was attached to the adhesive compared to when the adhesive was applied and distributed on the substrate. Such interfacial voids can be efficiently removed or reduced by applying slight pressure on the bonded structure during adhesive curing, or by leveraging plasma-treated substrates, as less reported in the literature. This work provided practical suggestions for preparing adhesive joints with minimized interfacial air voids to enhance bonding performance, particularly for dissimilar joints such as metal-CFRTP (carbon-fiber-reinforced thermoplastic polymer), as well as combinations with different types of polymer composites.

• Research Organization: Pacific Northwest National Laboratory (PNNL), Richland, WA (United States)
• Sponsoring Organization: USDOE
• DOE Contract Number: AC05-76RL01830
• OSTI ID: 2565929
• Report Number(s): PNNL-SA-198468
• Country of Publication: United States
• Language: English