Microstructural Coarsening Kinetics and Mechanical Property Changes in Long-Term Aged Sn–Pb–Sb Solder Joints

Susan, Donald F.; Wheeling, Rebecca A.; Williams, Shelley M.; Yang, Jeier; Jaramillo, Celedonio E.

doi:10.1007/s13632-024-01129-3

Microstructural Coarsening Kinetics and Mechanical Property Changes in Long-Term Aged Sn–Pb–Sb Solder Joints

Journal Article · Tue Sep 24 00:00:00 EDT 2024 · Metallography, Microstructure and Analysis

DOI:https://doi.org/10.1007/s13632-024-01129-3· OSTI ID:2475735

Susan, Donald F. ^[1]; Wheeling, Rebecca A. ^[2]; Williams, Shelley M. ^[1]; Yang, Jeier ^[1]; Jaramillo, Celedonio E. ^[1]

Sandia National Lab. (SNL-NM), Albuquerque, NM (United States)
Medtronic Inc., Brooklyn Center, MN (United States)

Tin-lead-antimony (50Sn–47Pb–3Sb wt.%) soldered assemblies were mechanically tested approximately 30 years after initial production and found to have solder joints of reduced strength. The microstructure of this solder alloy exhibits a ternary eutectic structure with Sn-rich, Pb-rich, and SnSb phases. Accelerated aging was performed to evaluate solder microstructural coarsening and associated strength of laboratory solder joints to correlate these properties to the “naturally aged” solder joints. Isothermal aging was conducted at room temperature, 55, 70, 100, and 135 °C and aging times that ranged from 0.1 to 365 days. The coarsening kinetics of the Pb-rich phase were determined through optical microscopy and image analysis methods established in previous studies on binary Sn–Pb solder. A kinetic equation was developed with time exponent n of 0.43 and activation energy of 24000 J/mol, suggesting grain boundary diffusion or other fast diffusion pathways controlling the microstructural evolution. Compression testing and Vickers microhardness showed significant strength loss within the first 20–30 days after soldering; then, the microstructure and mechanical properties changed more slowly over long periods of time. Further, by combining accelerated aging data and the microstructure-based kinetics, strength predictions were made that match well with the properties of the actual soldered assemblies naturally aged for 30 years. However, aging at the highest temperature of 135 °C produced anomalous behavior suggesting that extraneous aging mechanisms are active. Therefore, data obtained at this temperature or higher should not be used. Overall, the combined microstructural and mechanical property methods used in this study confirmed that the observed reduction in strength of ~ 30-year-old solder joints can be accounted for by the microstructural coarsening that takes place during long-term solid-state aging.

View Accepted Manuscript (DOE)

Research Organization:: Sandia National Laboratories (SNL-NM), Albuquerque, NM (United States)

Sponsoring Organization:: USDOE National Nuclear Security Administration (NNSA)

Grant/Contract Number:: NA0003525

OSTI ID:: 2475735

Report Number(s):: SAND--2024-14942J

Journal Information:: Metallography, Microstructure and Analysis, Journal Name: Metallography, Microstructure and Analysis Journal Issue: 5 Vol. 13; ISSN 2192-9262

Publisher:: SpringerCopyright Statement

Country of Publication:: United States

Language:: English

References (29)

Scanning Electron Microscopy and X-Ray Microanalysis Goldstein, Joseph I.; Newbury, Dale E.; Echlin, Patrick Springer New York, NY https://doi.org/10.1007/978-1-4613-0491-3	book	January 1992
The shear strength of copper and brass soldered with Sn-40% Pb containing 0 to 10% Sb and/or 0 to 15% Zn Tomlinson, W. J.; Rogers, P. A. Journal of Materials Science, Vol. 22, Issue 7 https://doi.org/10.1007/BF01082125	journal	July 1987
Fracture mechanism of brass/Sn-Pb-Sb solder joints and the effect of production variables on the joint strength Tomlinson, W. J.; Cooper, G. A. Journal of Materials Science, Vol. 21, Issue 5 https://doi.org/10.1007/BF01114732	journal	May 1986
The strength of brass/Sn-Pb-Sb solder joints containing 0 to 10% Sb Tomlinson, W. J.; Bryan, N. J. Journal of Materials Science, Vol. 21, Issue 1 https://doi.org/10.1007/BF01144706	journal	January 1986
A microstructural study of the thermal fatigue failures of 60sn-40Pb solder joints Frear, D.; Grivas, D.; Morris, J. W. Journal of Electronic Materials, Vol. 17, Issue 2 https://doi.org/10.1007/BF02652148	journal	March 1988
Formation mechanism of primary phases and eutectic structures within undercooled Pb-Sb-Sn ternary alloys Wang, WeiLi; Dai, FuPing; Wei, BingBo Science in China Series G: Physics, Mechanics and Astronomy, Vol. 50, Issue 4 https://doi.org/10.1007/s11433-007-0046-6	journal	August 2007
Investigation of microstructural coarsening in Sn-Pb alloys Kailasam, Sridhar K.; Glicksman, Me.; Mani, S. S. Metallurgical and Materials Transactions A, Vol. 30, Issue 6 https://doi.org/10.1007/s11661-999-0091-z	journal	June 1999
Microstructure coarsening during static annealing of 60Sn40Pb solder joints: I stereology Jung, Kang; Conrad, Hans Journal of Electronic Materials, Vol. 30, Issue 10 https://doi.org/10.1007/s11664-001-0114-z	journal	October 2001
Microstructure coarsening during static annealing of 60Sn40Pb solder joints: II eutectic coarsening kinetics Jung, Kang; Conrad, Hans Journal of Electronic Materials, Vol. 30, Issue 10 https://doi.org/10.1007/s11664-001-0115-y	journal	October 2001
Microstructural Coarsening and Mechanical Properties of Eutectic Sn-58Bi Solder Joint During Aging Wang, Fengjiang; Luktuke, Amey; Chawla, Nikhilesh Journal of Electronic Materials, Vol. 50, Issue 12 https://doi.org/10.1007/s11664-021-09255-2	journal	October 2021
Microstructure coarsening during thermo-mechanical fatigue of Pb-Sn solder joints Hacke, P. L.; Sprecher, A. F.; Conrad, H. Journal of Electronic Materials, Vol. 26, Issue 7 https://doi.org/10.1007/s11664-997-0251-0	journal	July 1997
Phase coarsening and crack growth rate during thermo-mechanical cycling of 63Sn37Pb solder joints Hacke, P. L.; Fahmy, Y.; Conrad, H. Journal of Electronic Materials, Vol. 27, Issue 8 https://doi.org/10.1007/s11664-998-0125-0	journal	August 1998
Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigue Vianco, P. T.; Burchett, S. N.; Neilsen, M. K. Journal of Electronic Materials, Vol. 28, Issue 11 https://doi.org/10.1007/s11664-999-0170-3	journal	November 1999
Microstructural coarsening in Sn-Ag-based solders and its effects on mechanical properties Dutta, I.; Kumar, P.; Subbarayan, G. JOM, Vol. 61, Issue 6 https://doi.org/10.1007/s11837-009-0085-8	journal	June 2009
Hardening process in ternary lead-antimony-tin alloys for battery grids Hilger, J. Journal of Power Sources, Vol. 53, Issue 1 https://doi.org/10.1016/0378-7753(94)01977-4	journal	January 1995
Interface diffusion in eutectic Pb–Sn solder Gupta, D.; Vieregge, K.; Gust, W. Acta Materialia, Vol. 47, Issue 1 https://doi.org/10.1016/S1359-6454(98)00348-6	journal	December 1998
Aspects of coarsening in eutectic Sn–Pb Matin, M. A.; Vellinga, W. P.; Geers, M. G. D. Acta Materialia, Vol. 52, Issue 12 https://doi.org/10.1016/j.actamat.2004.03.045	journal	July 2004
Computational modeling of phase separation and coarsening in solder alloys Anders, Denis; Hesch, Christian; Weinberg, Kerstin International Journal of Solids and Structures, Vol. 49, Issue 13 https://doi.org/10.1016/j.ijsolstr.2012.03.018	journal	June 2012
Investigation of stress exponent in the room-temperature creep of Sn–40Pb–2.5Sb solder alloy Mahmudi, R.; Rezaee-Bazzaz, A.; Banaie-Fard, H. R. Journal of Alloys and Compounds, Vol. 429, Issue 1-2 https://doi.org/10.1016/j.jallcom.2006.04.037	journal	February 2007
Automated Analysis of SEM X-Ray Spectral Images: A Powerful New Microanalysis Tool Kotula, Paul G.; Keenan, Michael R.; Michael, Joseph R. Microscopy and Microanalysis, Vol. 9, Issue 1 https://doi.org/10.1017/S1431927603030058	journal	January 2003
Diffusion of Sn in Pb to 30 kbar Decker, D. L.; Weiss, Jonathan D.; Vanfleet, H. B. Physical Review B, Vol. 16, Issue 6 https://doi.org/10.1103/PhysRevB.16.2392	journal	September 1977
Extreme Fast-Diffusion System: Nickel in Single-Crystal Tin Yeh, D. C.; Huntington, H. B. Physical Review Letters, Vol. 53, Issue 15 https://doi.org/10.1103/PhysRevLett.53.1469	journal	October 1984
A methodology to establish baseline metrics for assessing the isothermally aging of Sn‐Pb solder interconnects Vianco, P. T.; Rejent, J. A. Soldering & Surface Mount Technology, Vol. 14, Issue 2 https://doi.org/10.1108/09540910210427790	journal	August 2002
Microstructural changes of lead‐free solder joints during long‐term ageing, thermal cycling and vibration fatigue Fix, Andreas R.; Nüchter, Wolfgang; Wilde, Jürgen Soldering & Surface Mount Technology, Vol. 20, Issue 1 https://doi.org/10.1108/09540910810861440	journal	February 2008
Microstructurally Based Finite Element Simulation on Solder Joint Behaviour* Frear, D. R.; Burchett, S. N.; Neilsen, M. K. Soldering & Surface Mount Technology, Vol. 9, Issue 1 https://doi.org/10.1108/09540919710800601	journal	June 1997
Effect of Microstructure Size on Deformation Kinetics and Thermo-Mechanical Fatigue of 63Sn37Pb Solder Joints Guo, Zhenfeng; Conrad, Hans Journal of Electronic Packaging, Vol. 118, Issue 2 https://doi.org/10.1115/1.2792131	journal	June 1996
Computer Simulation of Thermo-Mechanical Fatigue of Solder Joints Including Microstructure Coarsening Hacke, P.; Sprecher, A. F.; Conrad, H. Journal of Electronic Packaging, Vol. 115, Issue 2 https://doi.org/10.1115/1.2909311	journal	June 1993
Impression creep of Sn–40Pb–2·5Sb peritectic solder alloy Rezaee-Bazzaz, A.; Mahmudi, R. Materials Science and Technology, Vol. 21, Issue 7 https://doi.org/10.1179/174328405X46079	journal	July 2005
Kinetics of Pb-rich Phase Particle Coarsening in Sn–Pb Solder Under Isothermal Annealing–cooling Rate Dependence Vianco, Paul; Rejent, Jerome; Zender, Gary Journal of Materials Research, Vol. 20, Issue 6 https://doi.org/10.1557/JMR.2005.0198	journal	June 2005