Controlled Spalling of 4H Silicon Carbide with Investigated Spin Coherence for Quantum Engineering Integration
- University of Chicago, IL (United States); Argonne National Laboratory (ANL), Argonne, IL (United States)
- University of Chicago, IL (United States)
- University of Chicago, IL (United States); Micron Technology, Inc., Boise, ID (United States)
We detail scientific and engineering advances which enable the controlled spalling and layer transfer of single crystal 4H silicon carbide (4H-SiC) from bulk substrates. 4HSiC’s properties, including high thermal conductivity and a wide bandgap, make it an ideal semiconductor for power electronics. Moreover, 4H-SiC is an excellent host of solid-state atomic defect qubits for quantum computing and quantum networking. Because 4H-SiC substrates are expensive (due to long growth times and limited yield), techniques for removal and transfer of bulk-quality films are desirable for substrate reuse and integration of the separated films. In this work, we utilize updated approaches for stressor layer thickness control and spalling crack initiation to demonstrate controlled spalling of 4H-SiC, the highest fracture toughness crystal spalled to date. We achieve coherent spin control of neutral divacancy (VV0) qubit ensembles and measure a quasi-bulk spin T2 of 79.7 μs in the spalled films.
- Research Organization:
- University of Chicago, IL (United States)
- Sponsoring Organization:
- Air Force Office of Scientific Research; USDOE Office of Science (SC), Basic Energy Sciences (BES); USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division (MSE)
- Grant/Contract Number:
- AC02-06CH11357
- OSTI ID:
- 2475438
- Alternate ID(s):
- OSTI ID: 2476930
- Journal Information:
- ACS Nano, Journal Name: ACS Nano Journal Issue: 45 Vol. 18; ISSN 1936-0851
- Publisher:
- American Chemical Society (ACS)Copyright Statement
- Country of Publication:
- United States
- Language:
- English
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