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Metals strengthen with increasing temperature at extreme strain rates

Journal Article · · Nature (London)
 [1];  [2]
  1. Massachusetts Institute of Technology (MIT), Cambridge, MA (United States); OSTI
  2. Massachusetts Institute of Technology (MIT), Cambridge, MA (United States); Northwestern University, Evanston, IL (United States)
The strength of materials depends on the rate at which they are tested, as defects, for example dislocations, that move in response to applied strains have intrinsic kinetic limitations. As the deformation strain rate increases, more strengthening mechanisms become active and increase the strength. However, the regime in which this transition happens has been difficult to access with traditional micromechanical strength measurements. Here, with microballistic impact testing at strain rates greater than 106 s−1, and without shock conflation, we show that the strength of copper increases by about 30% for a 157 °C increase in temperature, an effect also observed in pure titanium and gold. This effect is counterintuitive, as almost all materials soften when heated under normal conditions. This anomalous thermal strengthening across several pure metals is the result of a change in the controlling deformation mechanism from thermally activated strengthening to ballistic transport of dislocations, which experience drag through phonon interactions. These results point to a pathway to better model and predict materials properties under various extreme strain rate conditions, from high-speed manufacturing operations to hypersonic transport.
Research Organization:
Massachusetts Institute of Technology (MIT), Cambridge, MA (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES). Materials Sciences & Engineering Division (MSE)
Grant/Contract Number:
SC0018091
OSTI ID:
2471941
Journal Information:
Nature (London), Journal Name: Nature (London) Journal Issue: 8015 Vol. 630; ISSN 0028-0836
Publisher:
Nature Publishing GroupCopyright Statement
Country of Publication:
United States
Language:
English

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