Thermal Integration of a High Power Polyphase Inductive Coil Assembly

Conference · Sat Jun 01 00:00:00 EDT 2024

DOI:https://doi.org/10.1109/ITEC60657.2024.10598863· OSTI ID:2428055

Foote, Andrew ^[1]; Asa, Erdem ^[1]; Onar, Omer ^[1]

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1. ORNL

As inductive wireless power transfer reaches higher power levels; thermal management becomes essential. To address these concerns, past works have demonstrated the benefit of encapsulating coil assemblies with thermally conductive materials and integrating backside liquid cooling into coil assemblies. This work adds to these developments by considering the thermal analysis and construction of a liquid-cooled high power polyphase wireless power transfer ground assembly intended for long duration operation at high power levels, aiming towards hundreds of kW or even 1 MW.

• Research Organization: Oak Ridge National Laboratory (ORNL), Oak Ridge, TN (United States)
• Sponsoring Organization: USDOE; USDOE Office of Energy Efficiency and Renewable Energy (EERE)
• DOE Contract Number: AC05-00OR22725
• OSTI ID: 2428055
• Country of Publication: United States
• Language: English