Chemical vapor deposition of ternary refractory nitrides for diffusion barrier applications
As semiconductor device dimensions shrink, new diffusion barriers will be required. Amorphous refractory ternaries have been identified as promising barrier candidates; because sputtering may not be suitable, we have developed chemical vapor deposition processes for these materials. Acceptable deposition rates are found for each of these processes at 350 C, with all depositions performed between 300 and 450 C. The first process produces a range of Ti-Si-N compositions from Ti organometallic, SiH{sub 4}, and NH{sub 3}. Resistivity of the Ti-Si-N films changes with Si content from >1{Omega}-cm at 25 at.% Si down to that of TiN (200{mu}{Omega}-cm). Step coverage obtained is better than 80% on 0.5 {mu}m features with aspect ratios of >1.6. The second CVD process produces a range of W-Si-N film compositions from WF{sub 6}, Si{sub 2}H{sub 6}, and NH{sub 3}. Resistivities vary with composition from 350 to 20,000 {mu}{Omega}-cm. Step coverage obtained is 100% on reentrant 0.25 {mu}m features with aspect ratios of 4.0. The third process employs WF{sub 6}(reduced by SiH{sub 4}), B{sub 2}H{sub 6}, and NH{sub 3} to produce W-B-N films with a range of compositions. Resistivities range from 200 to 20,000 {mu}{Omega}-cm. Step coverage obtained is {approx}40% on 1.5 {mu}m features with aspect ratios of 5.5.
- Research Organization:
- Sandia National Labs., Albuquerque, NM (United States)
- Sponsoring Organization:
- USDOE, Washington, DC (United States)
- DOE Contract Number:
- AC04-94AL85000
- OSTI ID:
- 242662
- Report Number(s):
- SAND--96-0701C; CONF-9606104--2; ON: DE96011817
- Country of Publication:
- United States
- Language:
- English
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