Time-Temperature-Stress Superposition of PBX 9502 Compressive Creep Data for Lifetime Predictions

Technical Report · Tue Sep 26 04:00:00 EDT 2023

DOI:https://doi.org/10.2172/2378006· OSTI ID:2378006

Woznick, Caitlin Savanna ^[1]; Thompson, Darla Graff ^[1]; DeLuca, Racci ^[1]; Scott, Sidney John ^[1]

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1. Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)

The plastic-bonded explosive (PBX) 9502 is a viscoelastic, high-solids loaded polymer bound composite comprised of 95 weight% (wt%) TATB explosive crystals and 5 wt% FK-800 polymer binder. The uniaxial quasi-static mechanical properties have been studied and characterized extensively over 25+ years, including creep. Creep is the strain evolution over time as a result of an asymmetric load typically at temperatures above ambient. Creep measurements to failure can take excessively long periods of time depending on various factors including applied stress, temperature, and loading rate that render a single test to failure impossible. Using the principles of time-temperature-stress superposition (TTSSP), short-term creep tests at various applied stresses and temperatures can be used for long-term creep predictions. The TTSSP model shifts short-term test data using two factors, one for temperature and stress, creating a master curve at a reference test condition. The master curve can be shifted to predict the creep response at any desired test condition. PBX 9502 compression specimens were tested at three temperatures and various applied stresses. This work discusses the TTSSP analysis of PBX 9502 compressive creep data to create a single comprehensive master curve.

• Research Organization: Los Alamos National Laboratory (LANL), Los Alamos, NM (United States)
• Sponsoring Organization: USDOE National Nuclear Security Administration (NNSA)
• DOE Contract Number: 89233218CNA000001
• OSTI ID: 2378006
• Report Number(s): LA-UR--22-31092
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
37 INORGANIC, ORGANIC, PHYSICAL, AND ANALYTICAL CHEMISTRY
Creep
TTSSP