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Title: Development of A Hardware-In-the-Loop (HIL) Testbed for Cyber-Physical Security in Smart Buildings

Conference ·
OSTI ID:2331282

As smart buildings move towards open communication technologies, providing access to the Building Automation System (BAS) through the building's intranet, or even remotely through the Internet, has become a common practice. However, BAS was historically developed as a closed environment and designed with limited cyber-security considerations. Thus, smart buildings are vulnerable to cyber-attacks with the increased accessibility. This study introduces the development and capability of a Hardware-in-the-Loop (HIT) testbed for testing and evaluating the cyber-physical security of typical BASs in smart buildings. The testbed consists of three subsystems: (1) a real-time HIL emulator simulating the behavior of a virtual building as well as the Heating, Ventilation, and Air Conditioning (HVAC) equipment via a dynamic simulation in Modelica; (2) a set of real HVAC controllers monitoring the virtual building operation and providing local control signals to control HVAC equipment in the HIL emulator; and (3) a BAS server along with a web-based service for users to fully access the schedule, setpoints, trends, alarms, and other control functions of the HVAC controllers remotely through the BACnet network. The server generates rule-based setpoints to local HVAC controllers. Based on these three subsystems, the HIL testbed supports attack/fault-free and attack/fault-injection experiments at various levels of the building system. The resulting test data can be used to inform the building community and support the cyber-physical security technology transfer to the building industry.

Research Organization:
Texas A & M Univ., College Station, TX (United States). Texas A & M Engineering Experiment Station
Sponsoring Organization:
USDOE Office of Energy Efficiency and Renewable Energy (EERE) Building Technologies Office (BTO)
DOE Contract Number:
EE0009150
OSTI ID:
2331282
Resource Relation:
Journal Volume: 129; Journal Issue: Part1; Conference: 2023 ASHRAE Winter Conference, Atlanta, GA,USA
Country of Publication:
United States
Language:
English

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