Characterization of microstructure and tensile behavior of a cross-woven C-SiC composite

Journal Article · Mon Apr 01 04:00:00 EST 1996 · Acta Materialia

DOI:https://doi.org/10.1016/1359-6454(95)00292-8· OSTI ID:230782

Wang, M; Laird, C ^[1]

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1. Univ. of Pennsylvania, Philadelphia, PA (United States)

The microstructure of a cross-woven C-SiC composite and its effect on tensile behavior was studied in terms of damage and damage development. Microstructure characterization revealed that the composite contained processing-induced cracks and nonuniform fiber bundle sections with different fiber-matrix distributions. The processing-induced cracks and the soft matrix-discontinuous bundle sections were found to be two of the main reasons for the low composite modulus. A largely nonlinear tensile stress-strain behavior was observed together with a continued decrease of the modulus in the composite. This nonlinear tensile behavior was caused by the propagation of the processing-induced cracks, which led to low proportional limit, the multiplication of matrix cracks, and other damage modes such as fiber breaking ply delamination and bundle splitting. The tensile fracture of the composite was found to occur at the weak link bundle crossover sections, which showed very ragged fracture surfaces with limited fiber pull out.

• OSTI ID: 230782
• Journal Information: Acta Materialia, Journal Name: Acta Materialia Journal Issue: 4 Vol. 44; ISSN XZ504Y; ISSN 1359-6454
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
CARBON FIBERS
COMPOSITE MATERIALS
CRACK PROPAGATION
CRACKS
DAMAGE
FRACTOGRAPHY
MICROSTRUCTURE
SILICON CARBIDES
STRAINS
STRESSES
TENSILE PROPERTIES
VOIDS
YOUNG MODULUS