Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Influence of Indium on Microstructure and Properties of Sn-Pb Binary Alloy Applied in Photovoltaic Ribbon

Journal Article · · Journal of Materials Engineering and Performance
; ; ; ;  [1]
  1. Xi’an University of Technology, College of Materials Science and Engineering (China)
In this work, the conductivity, melting point, microstructure, spreading behavior, and mechanical properties of three types of Sn-Pb-In(indium) alloys are investigated along with Sn60Pb40 alloy as a reference. The results show that the In element improves the comprehensive properties of the Sn-Pb alloys. The maximum conductivity of the Sn-Pb-In alloys is 7.08 MS/m when the content of the In element is 3 wt.%. With an increasing content of the In element, the melting points of the Sn-Pb-In alloys gradually decrease from 183 to 166 °C. The microstructures of the alloys are refined with the addition of In. The intermetallic compound (IMC) InSn{sub 4} is only found in Sn60Pb34In6, except for the α-Pb and β-Sn phases. A spread test shows that only IMC Cu{sub 6}Sn{sub 5} is present at the Cu/solder interface of the solder joints. The Sn60Pb34In3 solder joint shows the highest ultimate tensile strength of 54 MPa. The microhardness of the alloys slightly increases from 12.76 HV{sub 0.05} to 13.56 HV{sub 0.05} with the In content increasing from 0 to 3 wt.%, while a sharp increase to 15.53 HV{sub 0.05} is observed when the amount of In exceeds 3 wt.%.
OSTI ID:
22970752
Journal Information:
Journal of Materials Engineering and Performance, Journal Name: Journal of Materials Engineering and Performance Journal Issue: 6 Vol. 28; ISSN 1059-9495; ISSN JMEPEG
Country of Publication:
United States
Language:
English

Similar Records

Effect of Multiple Reflow Cycles and Al{sub 2}O{sub 3} Nanoparticles Reinforcement on Performance of SAC305 Lead-Free Solder Alloy
Journal Article · Fri Jun 15 00:00:00 EDT 2018 · Journal of Materials Engineering and Performance · OSTI ID:22860435

Effect of Ag3Sn nanoparticles and temperature on Cu6Sn5 IMC growth in Sn-xAg/Cu solder joints
Journal Article · Thu Mar 15 00:00:00 EDT 2018 · Materials Research Bulletin · OSTI ID:22805453

Study on the Reliability of Carbon Nanotube-Reinforced Sn-58Bi Lead-Free Solder Joints
Journal Article · Thu Dec 14 23:00:00 EST 2017 · Journal of Materials Engineering and Performance · OSTI ID:22860745