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Thermophysical Properties of High-Frequency Induction Heat Sintered Graphene Nanoplatelets/Alumina Ceramic Functional Nanocomposites

Journal Article · · Journal of Materials Engineering and Performance
 [1];  [2]; ;  [3]
  1. King Saud University, Center of Excellence for Research in Engineering Materials (Saudi Arabia)
  2. Institute of Space Technology, Composite Research Center, Department of Materials Science and Engineering (Pakistan)
  3. University of Exeter, College of Engineering, Mathematics and Physical Sciences (United Kingdom)

This paper concerns the thermophysical properties of high-frequency induction heat (HFIH) sintered alumina ceramic nanocomposites containing various graphene nanoplatelets (GNP) concentrations. The GNP/alumina nanocomposites demonstrated high densities, fine-grained microstructures, highest fracture toughness and hardness values of 5.7 MPa m{sup 1/2} and 18.4 GPa, which found 72 and 8%, superior to the benchmarked monolithic alumina, respectively. We determine the role of GNP in tuning the microstructure and inducing toughening mechanisms in the nanocomposites. The sintered monolithic alumina exhibited thermal conductivity value of 24.8 W/mK; however, steady drops of 2, 15 and 19% were recorded after adding respective GNP contents of 0.25, 0.5 and 1.0 wt.% in the nanocomposites. In addition, a dwindling trend in thermal conductions with increasing temperatures was recorded for all sintered samples. Simulation of experimental results with proven theoretical thermal models showed the dominant role of GNP dispersions, microstructural porosity, elastic modulus and grain size in controlling the thermal transport properties of the GNP/alumina nanocomposites. Thermogravimetric analysis showed that the nanocomposite with up to 0.5 mass% of GNP is thermally stable at the temperatures greater than 875 °C. The GNP/alumina nanocomposites owning a distinctive combination of mechanical and thermal properties are promising contenders for the specific components of the aerospace engine and electronic devices having contact with elevated temperatures.

OSTI ID:
22860431
Journal Information:
Journal of Materials Engineering and Performance, Journal Name: Journal of Materials Engineering and Performance Journal Issue: 6 Vol. 27; ISSN 1059-9495; ISSN JMEPEG
Country of Publication:
United States
Language:
English