Skip to main content
U.S. Department of Energy
Office of Scientific and Technical Information

Systematic Insight into Chloride Concentration, Applied Potential and Time Effect on the Passive Film of Cu-Zn-Ni Ternary Alloy in Alkaline Solution

Journal Article · · Journal of Materials Engineering and Performance
; ;  [1];  [2];  [1];  [3]; ;  [1]
  1. University of Science and Technology Beijing, Corrosion and Protection Center, Key Laboratory for Corrosion and Protection (MOE) (China)
  2. Oil and Gas Technology Research Institute of PetroChina Changqing Oilfield Company (China)
  3. China University of Petroleum, State Key Laboratory of Petroleum Resource and Prospecting, Beijing Key Laboratory of Oil and Gas Pollution Prevention and Control (China)
The effects of chloride concentration, applied potential and time on the passive film of Cu-Zn-Ni ternary alloy in alkaline solution were systematically investigated using potentiodynamic and potentiostatic polarizations, electrochemical impedance spectroscopy, Mott–Schottky analysis, laser confocal microscopy, atomic force microscopy and x-ray photoelectron spectroscopy. Results showed that the pitting potential decreased as a linear function of log(a{sub Cl{sup −}}), and the size of pits extended faster in the horizontal direction than in the vertical direction. The passive oxide film formed on Cu-Zn-Ni alloy mainly exhibited p-type semiconductor behavior, which was consistent with cuprous and nickel oxide, the main components in the film. The density of cation vacancy (approximately 10{sup 20}-10{sup 21} cm{sup −3}) increased with potentiostatic time but reduced by the increasing potentials. The kinetics of passive film growth followed a parabolic law D = m * t{sup n}, where m is a constant considered as the initial growth rate and n is the time exponent. Subsequent to the formation of a compact and coherent passive film at higher potential, it was hard for an ion to migrate or for an aggressive ion to penetrate, which indicated better corrosion resistance for passive film formed under higher potential.
OSTI ID:
22860360
Journal Information:
Journal of Materials Engineering and Performance, Journal Name: Journal of Materials Engineering and Performance Journal Issue: 8 Vol. 27; ISSN 1059-9495; ISSN JMEPEG
Country of Publication:
United States
Language:
English