Leaching Studies for Copper and Solder Alloy Recovery from Shredded Particles of Waste Printed Circuit Boards

Journal Article · Fri Jun 15 04:00:00 EDT 2018 · Metallurgical and Materials Transactions B, Process Metallurgy and Materials Processing Science

DOI:https://doi.org/10.1007/S11663-018-1243-6· OSTI ID:22857934

Kavousi, Maryam; Sattari, Anahita; Fatmehsari, Davoud Haghshenas ^[1]

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1. Amirkabir University of Technology, Department of Mining and Metallurgical Engineering (Iran, Islamic Republic of)

Printed circuit boards (PCBs) comprise various metals such as Cu, Sn, and Pb, as well as platinum group metals. The recovery of metals from PCBs is important not only due to the waste treatment but also for recycling of valuable metals. In the present work, the leaching process of Cu, Sn, and Pb from PCBs was studied using fluoroboric acid and hydrogen peroxide as the leaching agent and oxidant, respectively. Pertinent factors including concentration of acid, temperature, liquid-solid ratio, and concentration of oxidizing agent were evaluated. The results showed 99 pct of copper and 90 pct solder alloy were dissolved at a temperature of 298 K (25 °C) for 180 minutes using 0.6 M HBF{sub 4} for the particle size range of 0.15 to 0.4 mm. Moreover, solid/liquid ratio had insignificant effect on the recovery of metals. Kinetics analysis revealed that the chemical control regime governs the process with activation energy 41.25 and 38.9 kJ/mol for copper and lead leaching reactions, respectively.

• OSTI ID: 22857934
• Journal Information: Metallurgical and Materials Transactions B, Process Metallurgy and Materials Processing Science, Journal Name: Metallurgical and Materials Transactions B, Process Metallurgy and Materials Processing Science Journal Issue: 3 Vol. 49; ISSN 1073-5615; ISSN MTBSEO
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
ACTIVATION ENERGY
ALLOYS
CONCENTRATION RATIO
CONTROL
COPPER
FLUOROBORIC ACID
HYDROGEN PEROXIDE
LEACHING
LEAD
LIQUIDS
MATERIALS RECOVERY
PARTICLE SIZE
PLATINUM
PRINTED CIRCUITS
REACTION KINETICS
SOLIDS
TIN