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Twisted cuprate van der Waals heterostructures with controlled Josephson coupling

Journal Article · · Materials Today
 [1];  [1];  [1];  [1];  [2];  [2];  [3];  [4];  [4];  [5];  [6];  [1];  [2]
  1. Leibniz Institute for Solid State and Materials Science Dresden (IFW Dresden) (Germany); Technische Universität Dresden (Germany)
  2. Leibniz Institute for Solid State and Materials Science Dresden (IFW Dresden) (Germany)
  3. Brookhaven National Laboratory (BNL), Upton, NY (United States)
  4. National Institute for Materials Science (NIMS), Tsukuba (Japan)
  5. University of Naples Federico II (Italy)
  6. Terra Quantum AG, St. Gallen (Switzerland); City University of New York (CUNY), NY (United States)

Twisted van derWaals (vdW) heterostructures offer a unique platform for engineering the efficient Josephson coupling between cuprate thin crystals harboring the nodal superconducting order parameter. Preparing the vdW heterostructures-based Josephson junction comprising stacked cuprates requires maintaining an ordered interface with preserved surface superconductivity. Here, we report the preparation of the Josephson junction out of the stacked Bi2Sr2CaCu2O8+d crystals using the cryogenic dry transfer technique and encapsulating the junction with an insulating layer, that protects the interface during the electrical contacts evaporation at the 1×10-6 mbar base pressure. We find that the Josephson critical current $$I$$c has a maximum at low twist angles, comparable to that of the bulk intrinsic Josephson junctions, and is reduced by two orders of magnitude at twist angles close to 45°. In conclusion, the reduction of $$I$$c occurs due to a mismatch between superconducting $$d$$-wave order parameters, which suppresses the direct Cooper pair tunneling.

Research Organization:
Brookhaven National Laboratory (BNL), Upton, NY (United States)
Sponsoring Organization:
USDOE Office of Science (SC), Basic Energy Sciences (BES); German Research Foundation (DFG); Japan Society for the Promotion of Science (JSPS)
Grant/Contract Number:
SC0012704
OSTI ID:
2284061
Report Number(s):
BNL--225258-2024-JAAM
Journal Information:
Materials Today, Journal Name: Materials Today Vol. 67; ISSN 1369-7021
Publisher:
ElsevierCopyright Statement
Country of Publication:
United States
Language:
English

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