Microstructure evolution and mechanical properties of Cu/Sn/Ag TLP-bonded joint during thermal aging
- Department of Mechanical Engineering, Tsinghua University, Beijing 100084 (China)
Highlights: • The thermal reliability of the Cu/Sn/Ag TLP-bonded joint was investigated through high-temperature storage. • A diffusion reaction occurred at the interface between Cu{sub 3}Sn and Ag{sub 3}Sn during thermal aging. • The mechanism of the Cu{sub 3}Sn/Ag{sub 3}Sn interfacial reaction was investigated from thermodynamics and kinetics. - Abstract: Low-temperature transient liquid phase (TLP) bonding is a promising joining technology for high-temperature electronic devices packaging. However, the effect of thermal aging on the joint microstructure and performance has been rarely studied so far. In this paper, the relationship between microstructural evolution and mechanical property was developed for the Cu/Sn/Ag TLP-bonded joint during 350 °C aging. Experimental results show that an interfacial reaction occurs between the intermetallic compounds (IMCs) of Cu{sub 3}Sn and Ag{sub 3}Sn, which induces that a great amount of Cu{sub 3}Sn particles or wedges embed into the Ag-Sn phase layer. The reaction process is controlled by a volume diffusion of Cu elements from the Cu substrate, and capable of promoting the transformation from Ag{sub 3}Sn into Ag(Sn) solid solution. Cu{sub 41}Sn{sub 11} phase can be formed at the expense of Cu{sub 3}Sn and Cu, of which transformation process is completely achieved after aging for 480 h, and the Cu(Sn) solid solution intimately contacts with the opposite Ag(Sn) solid solution in many areas after aging for 960 h. The joint mechanical property initially declines due to the formation of Cu{sub 41}Sn{sub 11} phase and Cu-Sn IMCs grain coarsening, and then increases because of the complete depletion of Cu{sub 3}Sn and substantial precipitation of Cu(Sn) solid solution. After aging for nearly 1000 h, the joint still maintains a high shear strength of >40 MPa, indicating an excellent thermal reliability.
- OSTI ID:
- 22805810
- Journal Information:
- Materials Characterization, Vol. 144; Other Information: Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
- Country of Publication:
- United States
- Language:
- English
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