Interfacial structure and bonding mechanism of weld seams during porthole die extrusion of aluminum alloy profiles
- Key Laboratory for Liquid-Solid Structural Evolution and Processing of Materials (Ministry of Education), Shandong University, Jinan, Shandong 250061 (China)
Highlights: • Interfacial structures and bonding mechanisms of extrusion welds were studied. • Interfacial grain boundaries, amorphous layers and voids were found. • Bonding mechanisms in the absence/presence of a gas-pocket were proposed. • Voids closure, oxide films breaking and grain boundaries migration were discussed. - Abstract: Fine nanostructures of bonding interfaces of weld seams formed by porthole die extrusion in the absence/presence of a gas-pocket behind the bridge of the extrusion die were systematically studied to understand the underlying interfacial bonding mechanisms. Interfacial grain boundaries, nanoscale amorphous layers, and three kinds of new interfacial structures were found. Specifically, it was found that, in the absence of a gas-pocket behind the bridge, there are two distinctly different interfacial structures. For the first kind of bonding interface, interfacial grain boundaries exist in contact areas and micro-voids exist in non-contact areas. For the second kind of bonding interface, there are no interfacial grain boundaries in contact areas and only nanoscale micro-voids exist in non-contact areas. In the presence of a gas-pocket behind the bridge, nanoscale voids and amorphous layers exist at the bonding interface. It was also found that the formation of gas-pockets can be avoided by increasing the depth of the welding chamber, and the increase of the welding chamber's depth and extrusion speed also contributes to the volume reduction of micro-voids and the migration of grain boundaries at the bonding interface, so as to improve the welding quality of weld seams. Based on the experimental findings, two interfacial bonding mechanisms corresponding to the absence/presence of a gas-pocket are proposed. The specific behavior of micro-asperities contact, micro-voids closure, oxide films breaking and interfacial grain boundaries migration are described, and the solid-state bonding process during porthole die extrusion is revealed from the micro-nano scales.
- OSTI ID:
- 22804941
- Journal Information:
- Materials Characterization, Vol. 138; Other Information: Copyright (c) 2017 Elsevier Science B.V., Amsterdam, The Netherlands, All rights reserved.; Country of input: International Atomic Energy Agency (IAEA); ISSN 1044-5803
- Country of Publication:
- United States
- Language:
- English
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