Micro-structural evolution during diffusion bonding of C-SiC/C-SiC composite using Ti interlayer

Journal Article · Mon Jan 15 04:00:00 EST 2018 · Materials Characterization

DOI:https://doi.org/10.1016/J.MATCHAR.2017.11.031· OSTI ID:22804858

Patel, Manish; Singh, Vajinder; Singh, Sarabjit; Bhanu Prasad, V. V. ^[1]

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1. Defence Metallurgical Research Laboratory, Hyderabad 500058 (India)

Highlights: • Formation of Ti{sub 3}SiC{sub 2} MAX phase in the joint of C-SiC composite • EBSD revealed three zone microstructure of the joint • Formation of a thin continuous layer of TiSi{sub 2} • The apparent shear strength of 19 MPa - Abstract: Diffusion bonding of C-SiC composite was achieved with Ti interlayer at 1500 °C for 3 h with the applied pressure of 20 MPa. The joined C-SiC composite showed the apparent shear strength of 19 MPa and the sample fractured away from the joint. The microstructure of joint consists of Ti{sub 3}SiC{sub 2} MAX phase, TiSi{sub 2} and TiC in which Ti{sub 3}SiC{sub 2} was the major phase. The distribution of phases in the microstructure of joint was categorized into three different zones based on electron backscattered diffraction (EBSD) results. The first zone consists of a thin continuous TiSi{sub 2} phase, which was followed by a thick zone of Ti{sub 3}SiC{sub 2} MAX phase. In the middle of the sample, a mix phase zone was found. The reaction mechanism was established for the evolution above microstructure of joined C-SiC composite.

• OSTI ID: 22804858
• Journal Information: Materials Characterization, Journal Name: Materials Characterization Vol. 135; ISSN 1044-5803; ISSN MACHEX
• Country of Publication: United States
• Language: English

Related Subjects

36 MATERIALS SCIENCE
BACKSCATTERING
COMPOSITE MATERIALS
DIFFUSION
DISTRIBUTION
ELECTRON DIFFRACTION
EVOLUTION
LAYERS
MICROSTRUCTURE
PRESSURE RANGE MEGA PA 10-100
SHEAR PROPERTIES
SILICON CARBIDES
TITANIUM
TITANIUM CARBIDES
TITANIUM SILICIDES