Plasticity-mediated deformation instabilities in thin film-compliant substrate systems: direct three-dimensional simulations

Nikravesh, Siavash; Shen, Yu-Lin

doi:10.1007/s10853-023-09248-y

Plasticity-mediated deformation instabilities in thin film-compliant substrate systems: direct three-dimensional simulations

Journal Article · Tue Jan 02 23:00:00 EST 2024 · Journal of Materials Science

DOI:https://doi.org/10.1007/s10853-023-09248-y· OSTI ID:2275005

Nikravesh, Siavash;

Abstract

Surface wrinkles driven by mechanical instability commonly form in thin-film structures attached to a compliant substrate. In this study, a recently developed computational approach is employed to simulate the formation and transformation of wrinkles involving plastic yielding of the thin film. The three-dimensional (3D) finite element models contain an embedded imperfection at the film-substrate interface, serving to trigger the bifurcation modes. Successful application of this technique to allow for film plasticity is demonstrated, including the evolution of 3D surface patterns and their correlation with the overall load–displacement response. The simulations reveal that plastic yielding transforms the surface instability patterns into more localized forms. Under uniaxial loading, the sinusoidal elastic wrinkles undergo the wrinkle-to-fold transition. With equi-biaxial loading, the initial square-checkerboard array turns into continuous tall ridges along the 45° directions. In both loading modes, the plasticity-induced instability patterns are only partially relieved upon unloading, leaving permanent features on the surface.

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Sponsoring Organization:: USDOE

Grant/Contract Number:: NA0004113

OSTI ID:: 2275005

Alternate ID(s):: OSTI ID: 2404528

Journal Information:: Journal of Materials Science, Journal Name: Journal of Materials Science Journal Issue: 12 Vol. 59; ISSN 0022-2461

Publisher:: Springer Science + Business MediaCopyright Statement

Country of Publication:: United States

Language:: English

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