Note: A component-level frequency tunable isolator for vibration-sensitive chips using SMA beams
- School of Energy and Power Engineering, Beihang University, Beijing 100191 (China)
This note presents a component-level frequency tunable isolator for vibration-sensitive chips. The isolator employed 8 U-shaped shape memory alloy (SMA) beams to support an isolation island (used for mounting chips). Due to the temperature-induced Young’s modulus variation of SMA, the system stiffness of the isolator can be controlled through heating the SMA beams. In such a way, the natural frequency of the isolator can be tuned. A prototype was fabricated to evaluate the concept. The test results show that the natural frequency of the isolator can be tuned in the range of 64 Hz–97 Hz by applying different heating strategies. Moreover, resonant vibration can be suppressed significantly (the transmissibility decreases about 65% near the resonant frequency) using a real-time tuning method.
- OSTI ID:
- 22597996
- Journal Information:
- Review of Scientific Instruments, Journal Name: Review of Scientific Instruments Journal Issue: 6 Vol. 87; ISSN 0034-6748; ISSN RSINAK
- Country of Publication:
- United States
- Language:
- English
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