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Title: Study of RF breakdown and multipacting in accelerator components

Conference ·

Radio frequency (RF) structures that are part of accelerators and energy sources, operate with sinusoidally varying electromagnetic fields under high RF energy. Here, RF breakdown and multipacting take place in RF structures and limit their performance. Electron field emission processes in a RF structure are precursors for breakdown processes. RF breakdown is a major phenomena affecting and causing the irreversible damage to RF structures. Breakdown rate and the damage induced by the breakdowns are its important properties. The damage is related to power absorbed during breakdown, while the breakdown rate is determined by the amplitudes of surface electric and magnetic fields, geometry, metal surface preparation and conditioning history. It limits working power and produces irreversible surface damage. The breakdown limit depends on the RF circuit, structure geometry, RF frequency, input RF power, pulse width, materials used, surface processing technique and surface electric and magnetic fields. Multipactor (MP) is a low power, electron multiplication based resonance breakdown phenomenon in vacuum and is often observed in RF structures. A multipactor discharge is undesirable, as it can create a reactive component that detunes the resonant cavities and components, generates noise in communication system and induces gas desorption from the conductor surfaces. In RF structures, certain conditions are required to generate multipacting. (author)

Research Organization:
Bhabha Atomic Research Centre, Mumbai (India); Indian Vacuum Society, Mumbai (India)
OSTI ID:
22597158
Resource Relation:
Conference: ISDEIV-2014: 26. international symposium on discharges and electrical insulation in vacuum, Mumbai (India), 28 Sep - 3 Oct 2014; Other Information: Country of input: India; 7 refs., 2 figs.; This record replaces 48041786; Related Information: In: Proceedings of the twenty sixth international symposium on discharges and electrical insulation in vacuum. V. 1| 438 p.
Country of Publication:
United States
Language:
English

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