Disruption of crystalline structure of Sn3.5Ag induced by electric current

Journal Article · Mon Mar 21 00:00:00 EDT 2016 · Journal of Applied Physics

DOI:https://doi.org/10.1063/1.4944033· OSTI ID:22596917

Huang, Han-Chie; Lin, Kwang-Lung ^[1]; Wu, Albert T. ^[2]

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1. Department of Material Science and Engineering, National Cheng Kung University, Tainan 70101, Taiwan (China)
2. Department of Chemical and Material Engineering, National Central University, Jhongli 32001, Taiwan (China)

This study presented the disruption of the Sn and Ag{sub 3}Sn lattice structures of Sn3.5Ag solder induced by electric current at 5–7 × 10{sup 3} A/cm{sup 2} with a high resolution transmission electron microscope investigation and electron diffraction analysis. The electric current stressing induced a high degree of strain on the alloy, as estimated from the X-ray diffraction (XRD) peak shift of the current stressed specimen. The XRD peak intensity of the Sn matrix and the Ag{sub 3}Sn intermetallic compound diminished to nearly undetectable after 2 h of current stressing. The electric current stressing gave rise to a high dislocation density of up to 10{sup 17}/m{sup 2}. The grain morphology of the Sn matrix became invisible after prolonged current stressing as a result of the coalescence of dislocations.

• OSTI ID: 22596917
• Journal Information: Journal of Applied Physics, Vol. 119, Issue 11; Other Information: (c) 2016 AIP Publishing LLC; Country of input: International Atomic Energy Agency (IAEA); ISSN 0021-8979
• Country of Publication: United States
• Language: English

Related Subjects

75 CONDENSED MATTER PHYSICS
SUPERCONDUCTIVITY AND SUPERFLUIDITY
71 CLASSICAL AND QUANTUM MECHANICS
GENERAL PHYSICS
COALESCENCE
DISLOCATIONS
ELECTRIC CURRENTS
ELECTRON DIFFRACTION
INTERMETALLIC COMPOUNDS
MATRICES
MORPHOLOGY
PEAKS
RESOLUTION
SILVER
STRAINS
STRESSES
TIN
TRANSMISSION ELECTRON MICROSCOPY
X RADIATION
X-RAY DIFFRACTION