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Strain accommodation through facet matching in La{sub 1.85}Sr{sub 0.15}CuO{sub 4}/Nd{sub 1.85}Ce{sub 0.15}CuO{sub 4} ramp-edge junctions

Journal Article · · APL Materials
DOI:https://doi.org/10.1063/1.4927796· OSTI ID:22499236
; ; ; ; ;  [1]
  1. Electron Microscopy for Materials Science (EMAT), Department of Physics, University of Antwerp, Groenenborgerlaan 171, B-2020 Antwerp (Belgium)
Scanning nano-focused X-ray diffraction and high-angle annular dark-field scanning transmission electron microscopy are used to investigate the crystal structure of ramp-edge junctions between superconducting electron-doped Nd{sub 1.85}Ce{sub 0.15}CuO{sub 4} and superconducting hole-doped La{sub 1.85}Sr{sub 0.15}CuO{sub 4} thin films, the latter being the top layer. On the ramp, a new growth mode of La{sub 1.85}Sr{sub 0.15}CuO{sub 4} with a 3.3° tilt of the c-axis is found. We explain the tilt by developing a strain accommodation model that relies on facet matching, dictated by the ramp angle, indicating that a coherent domain boundary is formed at the interface. The possible implications of this growth mode for the creation of artificial domains in morphotropic materials are discussed.
OSTI ID:
22499236
Journal Information:
APL Materials, Journal Name: APL Materials Journal Issue: 8 Vol. 3; ISSN AMPADS; ISSN 2166-532X
Country of Publication:
United States
Language:
English

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